--- title: KRÜSS Webinar | Engineering Surface Reactions in CMP (Semicon 1) description: How Modified Chemistries Control Surface Interactions to Enhance Performance --- [![KRÜSS Scientific - Explore the World of Surface Science](https://visit.kruss-scientific.com/hubfs/blue_logo_kruss-01.svg "KRÜSS Scientific - Explore the World of Surface Science")](https://www.kruss-scientific.com/en) ## Focus Webinar | Semiconductor Series: Part 1 # **Engineering Surface Reactions in CMP** #### How modified chemistries control surface interactions to enhance performance In the first webinar in this three-part series, we will explore how modified CMP chemistries can be used to control surface interactions at the wafer interface in order to improve polishing performance. The discussion will focus on how changes in slurry formulation influence wettability, surface energy, film formation, and chemical reactivity, all of which contribute to material removal behavior and defect generation. [Register](https://visit.kruss-scientific.com/webinar/semicon-1-engineering-surface-reactions-in-cmp#form) ![ext-semiconductor-03-2048x1152px](https://visit.kruss-scientific.com/hs-fs/hubfs/k-images-2048%C3%971152px/ext-semiconductor-03-2048x1152px.png?width=1600&height=898&name=ext-semiconductor-03-2048x1152px.png)   Register now for this webinar hosted by Dr. Jason Keleher (Lewis University, Keleher Research Group) to learn about the breakthrough research he and his team are performing in the semiconductor space! Using the KRÜSS DSA100W, we can characterize contact angle and surface energy changes before and after chemical treatment to better understand how chemistry modifies the surface. The KRÜSS DFA100 can then be used to evaluate foam and bubble behavior in slurry or cleaner formulations, providing additional insight into formulation stability and how fluid behavior may influence surface contact during processing. ## **What you will learn** - How modified CMP chemistries alter wettability and surface interactions at the wafer interface - How contact angle and surface energy measurements from the DSA100W can be used to evaluate chemical effects on the surface - How bubble and foam behavior measured by the DFA100 can help assess formulation stability and fluid behavior - How these surface and fluid interactions relate to polishing performance, removal behavior, and defect reduction ## **Webinar series** - **Part 1: Engineering Surface Reactions in CMP** How modified chemistries control surface interactions to enhance performance - ***Part 2: Understanding Particle Removal Efficiency (PRE)*** *How substrate surface characteristics influence removal mechanisms in p-CMP cleaning* - ***Part 3: Imagining a More Sustainable CMP and p-CMP Future*** *Balancing performance, defect control, and environmental impact through surface science* ## **Speaker** **![Dr Jason Keleher 1200x1200](https://visit.kruss-scientific.com/hs-fs/hubfs/k-people-1000%C3%971000px/Dr%20Jason%20Keleher%201200x1200.png?width=200&height=200&name=Dr%20Jason%20Keleher%201200x1200.png)** **Dr. Jason J. Keleher** is Full Professor and Chair of Chemistry at Lewis University, where he leads the Keleher Research Group (KRG), focusing on engineered nanoparticles, hybrid materials, surface interactions, and sustainable technologies. Prior to academia, he held research positions at Komag and Cabot Microelectronics (now Entegris), earning the company's Inventor of the Year award for his contributions to surface chemistry and product development. An award-winning educator and advocate for diversity in STEM, Dr. Keleher has co-authored more than 50 peer-reviewed publications, been awarded 25 U.S. patents, and delivered over 500 technical presentations worldwide. ## **Live Webinar** Register now to explore how modified CMP chemistries can be used to control surface interactions at the wafer interface in order to improve polishing performance. *Can't make the date? 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