Advancing Semiconductor Manufacturing with Surface Science

Precision solutions for wafer cleanliness, resin adhesion, and process optimization

Improve your outcomes with surface science

With vast experience in interfacial analysis, KRÜSS partners with semiconductor manufacturers and research facilities to drive innovation and efficiency across the entire development cycle.

Our extensive portfolio of instrumentation and software enable flexible setups for complex measuring tasks. Moreover, standardized testing strategies ensure optimal wettability, adhesion, and cleanliness in semiconductor processes. Discover how our advanced solutions support every step from wafer preparation and cleanliness assessment to chip packaging and adhesion optimization.

Planarization

Chemical-mechanical planarization (CMP) relies on surfactants to create an optimally mixed slurry with effective wetting properties. KRÜSS tensiometers measure surface tension to ensure slurry consistency, while foam analyzers assess and control undesirable foaming, crucial for maintaining process stability.

Wafer cleanliness

Ensuring contaminant-free wafer surfaces is fundamental for subsequent processing steps. Contact angle measurements are highly sensitive to contamination or cleaner residues, making them ideal for optimizing and quality-controlling various frontend cleaning steps. Our contact angle instruments provide precise assessments without compromising wafer integrity.

Automated batch testing

For series QC checks for cleanliness or wettability, mobile contact angle instruments are combined with robotic systems, the software seamlessly communicates with surrounding systems via APIs or the OPC UA protocol to integrate the contact angle measurement step into the ensemble of test steps.

Experience how automated batch testing with our mobile instruments works in a customer story of the Fraunhofer CSP institute.

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Ultrafast

Measure and read the result in seconds

User-independent

Parameters and measurement procedure are predefined

Non-destructive and hazard-free

Only drops of pure water get onto the sample

Proven

Tested with many polymers and metals, also plasma treated with different parameters

Wire Bonding

For robust electrical connections during wire bonding, bond pads must be free from contamination and oxidation. Micro-scale contact angle measurements offer critical insights into surface conditions. Specialized micro equipment enables accurate evaluations using picoliter droplets, ensuring optimal surface preparation for reliable wire bonds.

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Glob top encapsulation

Protecting sensitive components through glob top encapsulation requires coatings with strong adhesion and appropriate interfacial tension. Our Drop Shape Analyzers facilitate the assessment of these parameters, contributing to the long-term stability and reliability of encapsulated semiconductor devices.

Die underfilling

Effective underfilling with epoxy resin is vital to protect chips from mechanical stress and environmental factors. Optimal wetting ensures complete coverage and prevents air pockets. Our Drop Shape Analyzers support packaging engineers in evaluating wettability and calculating spreading speeds, facilitating efficient underfilling processes.

Our solutions elevate your semiconductor production

Explore our comprehensive range of precision instruments designed to enhance every stage of your semiconductor manufacturing process. Our portfolio includes advanced contact angle instruments, tensiometers, and foam analyzers, renowned for their precision, accuracy, and user-friendly operation. Designed and produced at our global headquarters in Germany, they cover a range of applications.

DSA100W

Automatic wettability and adhesion analysis of wafers and other round samples

Tensíío

The new generation tensiometer for liquid and solid surfaces

DFA100

The universal instrument for all aspects of liquid foam

Ayríís

Surface quality control has never been so easy and reliable

MSA One-Click SFE

Analyzing wettability in a second with only one click

DSA30M

Precision wettability analysis of microscopically small surfaces

DSA100E

The automated premium solution for wetting and adhesion analysis of solids and liquids

Dive deeper with our surface science experts

Do you want to know more about our solutions for optimizing frontend and backend steps for chip production? Don’t hesitate to get in touch to discuss your task or issue with our surface science experts.